Multiphysical modeling of microelectronic systems with heterogeneous integration

A. V. Achkasov; A. S. Yagodkin; F. Makarenko

doi:10.12737/2219-0767-2025-18-3-20-27

VAK Russia 2.3.7 UDC 004.9

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MULTIPHYSICAL MODELING OF MICROELECTRONIC SYSTEMS WITH HETEROGENEOUS INTEGRATION Multiphysical modeling of microelectronic systems with heterogeneous integration

АА Аа

Published in Modeling of systems and processes · Volume 18, Issue 3 · Pages 20–27 · Rubric: Tehnicheskie nauki

DOI: https://doi.org/10.12737/2219-0767-2025-18-3-20-27

Received: 05.10.2025 Accepted: 16.10.2025 Published: 16.10.2025

Authors

A. V. Achkasov

A. S. Yagodkin

F. Makarenko

A. V. Achkasov

Voronezh State University of Forestry and Technologies named after G.F. Morozov Voronezh

A. S. Yagodkin

Voronezh State University of Forestry and Technologies named after G.F. Morozov Voronezh

F. Makarenko

Voronezh State University of Forestry and Technologies named after G.F. Morozov Voronezh

ABSTRACT

The article presents modern methods of multiphysics modeling and simulation of heterogeneous integration processes in microelectronics. The research includes a comprehensive analysis of the thermal, mechanical, and electromagnetic characteristics of complex multi-component systems, combining various physical phenomena to improve the reliability and performance of microelectronic devices. Advanced software tools, including Ansys Multiphysics and EDA tools, are used for analysis, allowing for effective optimization of designs at the chip and package level. The results show that the use of redistribution layers, materials with low thermal expansion coefficients, and high-density interconnects significantly improves thermal management, reduces mechanical stresses, and lowers electromagnetic losses, which significantly enhances the overall efficiency and durability of systems. Local areas of overheating and stress concentration have been identified, and methods for minimizing them have been proposed, such as the use of air gaps and the optimization of interconnect geometry. The models have been verified using experimental data, which confirms the high accuracy of the simulations. The results obtained have important practical significance for the development of energy-efficient and reliable microelectronic solutions that are in demand in applications of artificial intelligence, high-performance computing, the Internet of Things, and other modern technologies that require high integration and compactness of devices. The work lays the foundation for further innovations in the field of microelectronics, helping to address the challenges posed by the slowdown in Moore's Law and the need for 3D integration.

KEYWORDS

Heterogeneous integration, multiphysics modeling, thermal processes, mechanical stresses, electromagnetic modeling, redistribution layers (RDL), coefficient of thermal expansion (CTE), high-density interconnects, 3D integration, and reliability of microelectronic systems.

1. Sammakia B.G., Ranganarajan S. Heterogeneous Integration Electronic Devices // Electronics. 2024. Volume 13. Special Issue. URL: https://www.mdpi.com/journal/electronics/special_issues/YN6MZCWYP9 (accessed: 23.08.2025).

2. Applied Materials. Heterogeneous Integration. URL: https://www.appliedmaterials.com/il/en/semiconductor/markets-and-inflections/heterogeneous-integration.html (accessed on 23.08.2025).

3. Bayraktaroglu B. Heterogeneous Integration Technology: Final Report. Wright-Patterson Air Force Base: Air Force Research Laboratory, 2017. 108 p. URL: https://apps.dtic.mil/sti/tr/pdf/AD1038452.pdf (accessed: 23.08.2025).

4. Wang H. et al. Thermal Modeling of 2.5D/3D Heterogeneous Integration Systems // IEEE Transactions on Components, Packaging and Manufacturing Technology. 2021. Vol. 11. No. 3. Pp. 401-410. DOI:https://doi.org/10.1109/TCPMT.2021.3051234

5. International Technology Roadmap for Semiconductors 2.0. 2015 Edition. URL: http://www.itrs2.net (date of publication: 23.08.2025).

6. Garrow P., Bauer S., and Ramm P. Handbook of 3D Integration: Technology and Applications of 3D Integrated Circuits. Weinheim: Wiley-VCH, 2019. 528 p.

7. Lau, J. H. Recent Advances in Three-Dimensional Heterogeneous Integration. Journal of Electronic Packaging. 2022. Vol. 144. No. 1. P. 010801. DOI:https://doi.org/10.1115/1.4052143.

8. Swaminathan, M. et al. Modeling for 3D Integration. IEEE Transactions on Components, Packaging and Manufacturing Technology. 2020. Volume 10, No. 12, pp. 1945-1956. DOI:https://doi.org/10.1109/TCPMT.2020.3031232.

9. SEMI Standards: Heterogeneous Integration Roadmap. 2023 Edition. URL: https://www.semi.org (accessed: 23.08.2025).

10. [10] Xie J. et al. Thermal Management Solutions for 3D IC Integration // Microelectronics Journal. 2021. Vol. 118. P. 105-212. DOI:https://doi.org/10.1016/j.mejo.2021.105212.

11. Nikolenko, S. D. Modeling of Internal Stresses in a Complex Material Structure / S. D. Nikolenko, S. P. Kozodaev, and S. A. Sazonova // Modeling of Systems and Processes. – 2024. – Vol. 17, No. 2. – Pp. 50-61. – DOIhttps://doi.org/10.12737/2219-0767-2024-17-2-50-61. – EDN DIXFHX.

12. Poluektov, A. V. Modeling the Influence of Electromagnetic Fields on Microchips / A. V. Poluektov, R. Yu. Medvedev, and K. V. Zolnikov // Modeling of Systems and Processes. – 2024. – Vol. 17, No. 1. – Pp. 129-136. – DOIhttps://doi.org/10.12737/2219-0767-2024-17-1-129-136. – EDN HWPUXU.

13. IMEC Annual Report 2024: Advanced Packaging Technologies. URL: https://www.imec-int.com (published on August 23, 2025).

14. Intel EMIB Technical Document: Embedded Multichip Bridge Technology. 2023. 24 p. URL: https://www.intel.com (published on August 23, 2025).

15. Silicon Austria Labs. Heterogeneous integration technologies. URL: https://silicon-austria-labs.com (accessed: 23.08.2025).

16. [16] Silicon Austria Labs. Annual Research Report 2024. 2024. 156 p. URL: https://silicon-austria-labs.com (published: 23.02.2025).

17. ANSYS Multiphysics User Manual. Version 2024 R1. Canonsburg: ANSYS Inc., 2024. 1200 pages.

18. AMD Radeon™ Fury X Technical Specifications. URL: https://www.amd.com (accessed on February 23, 2025).

19. Zhang, Y. et al. Advanced Wafer-Level Packaging for Heterogeneous Integration // Journal of Microelectronics and Electronic Packaging. 2022. Vol. 19. No. 4. Pp. 145-156. DOI:https://doi.org/10.17206/jmep.2022.19.4.145.

20. Texas Instruments. DLP® Technology for Automotive Applications. Application Report. 2023. 32 p.

21. Analog Devices. ADXL50 Accelerometer Technical Description. Edition C. 2024. 28 pages.

22. IMEC Technical Document on eCube Technology. 2024. 18 pages. URL: https://www.imec-int.com (accessed on 23.08.2025).

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Editor-in-Chief, editorial board chair

GOST

Achkasov A. V., Yagodkin A. S., Makarenko F. V. Multiphysical modeling of microelectronic systems with heterogeneous integration // Modeling of systems and processes. 2025. no. 3. pp. 20-27. DOI: https://doi.org/10.12737/2219-0767-2025-18-3-20-27. (Date of access 26.10.2026).

MLA

A. V. Achkasov, Yagodkin A. S., Makarenko F. V.. "Multiphysical modeling of microelectronic systems with heterogeneous integration." Modeling of systems and processes 18.3 (2025): 20-27. DOI: https://doi.org/10.12737/2219-0767-2025-18-3-20-27.

APA

Achkasov A. V., Yagodkin A. S., Makarenko F. V. (2025). Multiphysical modeling of microelectronic systems with heterogeneous integration. Modeling of systems and processes, 18(3), 20-27. https://doi.org/10.12737/2219-0767-2025-18-3-20-27

Chicago

A. V. Achkasov, Yagodkin A. S., Makarenko F. V.. "Multiphysical modeling of microelectronic systems with heterogeneous integration." Modeling of systems and processes 18, no. 3 (2025): 20-27. https://doi.org/10.12737/2219-0767-2025-18-3-20-27.

WIKI

{{cite journal | author = Achkasov A. V., Yagodkin A. S., Makarenko F. V. | title = Multiphysical modeling of microelectronic systems with heterogeneous integration | journal = Modeling of systems and processes | year = 2025 | volume = 18 | issue = 3 | pages = 20-27 | doi = 10.12737/2219-0767-2025-18-3-20-27 }}

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MULTIPHYSICAL MODELING OF MICROELECTRONIC SYSTEMS WITH HETEROGENEOUS INTEGRATION Multiphysical modeling of microelectronic systems with heterogeneous integration

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