%0 Journal Article
%T Multiphysical modeling of microelectronic systems with heterogeneous integration
%A Achkasov, A.V.
%A Yagodkin, A.S.
%A Makarenko, F.V.
%K Heterogeneous integration, multiphysics modeling, thermal processes, mechanical stresses, electromagnetic modeling, redistribution layers (RDL), coefficient of thermal expansion (CTE), high-density interconnects, 3D integration, and reliability of microelectronic systems.
%J Modeling of systems and processes
%D 2025
%N 18
%P 7
%I FSBE Institution of Higher Education Voronezh State University of Forestry and Technologies named after G.F. Morozov